3D topology optimization of heat sinks for liquid cooling
نویسندگان
چکیده
منابع مشابه
Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronics Devices
for their time and efforts in reviewing the proposals and dissertations and their helpful advices. My sincere gratitude goes to DARPA and Intel Corporation for their financial support. I would also like to thank the University of Maryland College Park for their financial support in the form of Graduate School Fellowship. I would also like to take this opportunity to express my appreciations and...
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ژورنال
عنوان ژورنال: Applied Thermal Engineering
سال: 2020
ISSN: 1359-4311
DOI: 10.1016/j.applthermaleng.2020.115540